There are several techniques / possibilities that will become standard processes for manufacturing circuits etc with LTCC. The following survey contains techniques both to be developed and in development.
- High permitive dielectric pastes to realize high capacities; a dielectric with a Dielectric Constant of k=200 is known and to be developed for standard processes
- Buried (active) components: with the help of this technique it will be possible to integrate active elements (chips) which mustn’t be cofired into the LTCC substrate. A carrier / substrate made of a LTCC with a cavity is processed, the chip mounted into and a lid (LTCC) is soldered on top to close the box (alternative: -> brick box).
- TB-BGA: the Top-Bottom Ball Grid Array allows to process single circuits to be mounted on top of each other (by soldering) to become a high functional device, with many different active components.
- Optical components, that make it possible to manufacture LTCC substrates / boxes with optical interfaces.
- Liquid and gas interfaces / conductors, which make it possible to integrate sensors and pipes for liquid (cooling) or gas into the LTCC substrate.
- Zero shrinking: because of the (uneven) shrinking of the LTCC tapes during the firing the printing widths and spacings are limited; with the help of a non-shrinking tape it would be possible to process finer structures. (Advantage for large circuits: high precision of contact arrays, e.g. BGAs.)
- Brick box system: constits of single formed parts of LTCC (carrier, lids), which are to be connected (e.g. by soldering) to become a complete box. The carrier(s) and lids contain the hole connecting structures (electrical, optical, fluidical) and interfaces to supply the to be mounted chip(s).
- Photo conductors
- Photo "tape" (vias)
- Photo resistors
- One process step for via forming and filling
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©2001-2010 IMST GmbH, Last update: May 2005
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