| ACF |
Advanced Ceramics Facility |
| AMI |
Advanced Multilayer Interconnect |
| BGA |
Ball Grid Array |
| COB |
Chip On Board |
| COF |
Chip On Flex
|
| CPW |
Coplanar Waveguide
|
| CS(P) |
Chip Scale (Packages)
|
| CTE |
Coefficient Of Thermal Expansion
|
| CTTE |
Close To The Edge Technology
|
| DCB |
Direct Copper Bond
|
| DF |
Dissipation Factor
|
| DFM |
Design for Manufacturability
|
| DIP |
Dual Inline Packaging
|
| DMMA |
Duplex Metal-Metalloid Alloy
|
| ESD |
Electrostatic Discharge
|
| FC |
Flip Chip
|
| FCB |
Flip Chip Bonding
|
| FCOB |
Flip Chip On Board
|
| FLDCC |
Fine Pitch Leaded Chip Carrier
|
| GGI |
Gold To Gold Interconnect
|
| HDI |
High Density Interconnect
|
| HDP |
High Density Package
|
| HTCC |
High Temperature Cofired Ceramic
|
| IMAPS |
International Microelectronics And Packaging Society
|
| IPC |
Integrated Passive Components
|
| IR |
Insulation Resistance
|
| k |
Dielectric Constant
|
| LGA |
Land Grid Array
|
| LIV |
Low inductance via
|
| LTCC |
Low Temperature Cofired Ceramic
|
| LTFC |
Low Temperature Firing Ceramic (LTCC)
|
| MCIC |
Multilayer Ceramic Integrated Circuit
|
| MCM |
Multi-Chip-Modules
|
| MCM - C |
Cofired Ceramic, thickfilm
|
| MCM - D |
Deposited Thinfilm
|
| MCM - L |
Laminated Printed Wiring Board (FR4, PCB, PTFE)
|
| MCOF |
Microwave Chip On Flex
|
| MCP |
Multi-Chip-Packages
|
| MIB |
Multilayer Interconnect Board
|
| MLC |
Multilayer Ceramic (for LTCC and HTCC)
|
| MLTF |
Multilayer Thin Film
|
| MMS |
Micro Module System
|
| MS |
Microstrip
|
| PCB |
Printed Circuit Board
|
| PCL |
Photoprintable Conductor on LTCC
|
| PGA |
Pin Grid Array
|
| PQFP |
Plastic Quad Flat Pack(age)
|
| PTF |
Polymer Thick Film
|
| PWB |
Printed Wiring Board
|
| QFP |
Quad Flat Package
|
| RLC |
Resistor, Inductor & Capacitor
|
| SBB |
Stub-Bump-Bonding
|
| SLAM |
Single Layer Packages
|
| SMT |
Surface Mount Technology
|
| SRF |
Self-Resonant Frequency
|
| S/B |
Side Brazed
|
| TCE |
Thermal Coefficient Of Expansion
|
| TFBGA |
Thin Film Ball Grid Array
|
| TFMSL |
Thin Film Microstrip Line
|
| TOS |
Tape On Substrate
|
| ZST |
Zero Shrink Tape
|
print view