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2 weeks LTCC seminar
  • 2 Weeks advanced LTCC Seminar
  • Training includes Theory and Practice
  • Qualified Staff
  • Modern Multimedia Equipment
  • Contact us here

Overview
LTCC as a ceramic multilayer technology has a great potential for Microwave applications. The dielectrics (tapes) as well as the gold and silver conductors have the appropriate physical and electrical performance. In spite of being a very mature technology, LTCC has recently gone through large improvements in material development and has become available for communication equipment manufacturers through LTCC foundries. The competitive price of materials and production makes LTCC an ideal basis for System in a Package (SiP) and Multi Chip Modules (MCM). LTCC circuits can consist of a nearly arbitrary number of layers. Components can be integrated in cavities. LTCC substrates are rugged, hermetic and environ-mentally stable. These features and further favourable characteristics are utilized to develop compact and efficient modules for communication and sensor applications. This 2 weeks seminar will give the attendees a deep insight into the theoretical background of LTCC and its RF and microwave applications. Furthermore a practice part is added, where the participants will go through all manufacturing steps. IMST's test coupon, which has been developed for benchmarking of LTCC material systems, will be processed in the clean-room laboratory of IMST. Finally microwave on-wafer measurements will be carried out to get insight into the characterization of high frequency circuits.

Theory Part Practice Part 1. Week 2. Week

Theoretical part with presentations

The theoretical presentations consist of about 25 sections with roughly 1000 viewgraphs in total. The LTCC class is divided into 9 chapters.. Presentations will be given in IMST's seminar rooms, which are equipped with modern technology. Handouts will be made available for all attendees.

1. Introduction, Schedule and Safety

1.1 Welcome
1.2 Introduction of IMST and the LTCC Team
1.3 Schedule and Organizational Issues
1.4 Safety in the Laboratory

2. LTCC Material Systems and Foundry Services

2.1 Tapes
2.2 Pastes and Inks
2.3 Material Systems and Suppliers
2.4 Comparison of Material Systems
2.5 Foundry Services

3. Waveguides

3.1 Overview of Applicable Waveguides
3.2 Microstrip Line (MS)
3.3 Coplanar Waveguide (CPW)
3.4 Stripline (SL)
3.5 Dielectric Filled Rectangular Waveguide (DRWG)
3.6 Via Side Walls

4. LTCC Manufacturing Process and Design Rules

4.1 Process Steps
- 4.1.0 Overview of process
- 4.1.1 Tape preparation and blanking
- 4.1.2 Via forming
- 4.1.3 Introduction to screen printing
- 4.1.4 Via filling with screen printer
- 4.1.5 Conductor printing
- 4.1.6 Stacking and lamination
- 4.1.7 Burnout and sintering
- 4.1.8 Inspection
- 4.1.9 Post-processing
4.2 Design and Layout Aspects
- 4.2.1 Passive Components
- 4.2.2 Thermal Design
- 4.2.3 Manufacturing Design Rules

5. Assembly and Integration Techniques

5.1 Transitions and Feedthrus
5.2 Chip Interconnects and Integration
5.3 Meshed Ground Planes
5.4 Packaging Technique

6. LTCC Benchmark

6.1 Evaluation of Ring Resonators (Part 1): DuPont 951 vs. Ferro A6S
6.2 Evaluation of Ring-Resonators (Part 2): Comparison of Low Loss LTCC Materials
6.3 Conductor Properties

7. Applications and Examples

7.1 Overview of RF and Microwave Applications
- 7.1.1 Passive Components
- 7.1.2 Active Components
- 7.1.3 Antennas
- 7.1.4 Modules
- 7.1.5 Further Examples
7.2 LTCC Circuits and Modules
- 7.2.1 SMD Lowpass Filter @ 800 MHz
- 7.2.2 Balun for Push-pull PA @ 0.9 + 1.8 GHz
- 7.2.3 BluetoothTM Modules @ 2.45 GHz
- 7.2.4 FMCW Radar Frontend @ 24 GHz
- 7.2.5 LMDS Transceiver @ 25 GHz
- 7.2.6 Point-to-Point Transceiver @ 28 GHz
- 7.2.7 Fixed Wireless Access Frontend @ 41 GHz
- 7.2.8 Antennas and Digital Beam Forming @ 30 GHz
- 7.2.9 Ka-Band Technology for Satellite Applications @ 20 GHz
- 7.2.10 X-Band Tx/Rx Module @ 9 to 10 GHz
- 7.2.11 Liquid Crystal in LTCC
- 7.2.12 60 GHz WLAN

8. Tests and Measurements

8.1 Basics of RF and microwave theory
8.2 Planar waveguide technologies
8.3 S-parameter on-waver and coaxial measurements
8.4 Calibration methods

9. RF and Microwave Module Analysis and Design

9.1 RF and Microwave Design Guides
9.2 3-D Modelling and EM-Analysis with EMPIRETM
9.3 Multilayer Circuit Simulation with MultiLibTM

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Practice part

IMST's LTCC test coupon on DuPont 951 with silver conductors will be manufactured from the participants under supervision of our specialists. The prototype process and the inspection equipment is installed in a clean-room laboratory. The max. number of participants is limited to 4.


Front view of test tile (DuPont 943)

Back view of test tile (DuPont 943)

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Schedule for 2 weeks

W1 and W2: first and second week
M1 and M2: first and second morning sessions
A1 and A2: first and second afternoon sessions
C: classroom session
L: laboratory session
E: excursion

W1 Monday Tuesday Wednesday Thursday Friday
M1 C Welcome and Introduction of IMST and LTCC Team

Schedule of the training and organizational issues
C Process step: Screen printing

Material systems and foundry services (Part 1)
C Applications and examples: Overview of IMST's solutions

Process step: Burnout and sintering
E Visit of IMST's test labs:
microwave circuits,
antenna measurement ...
L Final layer inspection:
Microscopy,
profilometer
Coffee break
M2 C Introduction of guests

Safety instructions for laboratories
C Process step: Stacking and lamination

Material systems and foundry services (Part 2)
C Applications and examples: LTCC modules (Part 1)

Process step: Inspection and post-processing
C Process Steps;
Recap, questions and answers
L Manual stacking

Stacking machine
Lunch break
A1 C

L
Process steps: Overview and Via Forming

Introduction of clean-room facilities
L Via/cavity forming (punching) L Via Filling

Inspection of vias
L Conductor
screen-printing
L Preparation for lamination (vacuum bag)

Isostatic lamination
Coffee break
A2 L Blanking

Via/cavity forming (laser cutting)
L Introduction to screen printer

Characterization of pastes (viscosity)
L Preparations to screen-printing L Conductor
screen-printing
L Process furnace: preparations and start of sintering

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W2 Monday Tuesday Wednesday Thursday Friday
M1 C Applications and examples: LTCC modules (Part 2)

Passive components
(Part 1)
C RF and microwave design guides
(Part 1)

RF and microwave design guides
(Part 2)
C RF tests and measurements (Part 1 + 2) C 3D-modelling and EM-analysis with EMPIRE
(Part 1 + 2)
C Catch-up session for delayed theory parts
Coffee break
M2 C Passive components
(Part 2)

LTCC Benchmark and test coupon
C Thermal design

Manufacturing and design rules
C RF tests and measurements (Part 3 + 4) C Multilayer circuit simulation with MultiLib

LTCC antenna design
C Recap, questions and answers

Summary of theory and practice
Lunch break
A1 L Resistor printing L Resistor measurements and trimming L Characterization of test patterns from LTCC benchmark coupon (Part 1) L Post-processing:
inspection, dicing, SMT, bonding ...
L Catch-up session for delayed practice parts
Coffee break
A2 L Inspection

Start of resistor firing
L LTCC Test Coupon:

Inspection and Tests

L Characterization of test patterns from LTCC benchmark coupon (Part 2) L Post-processing:
inspection, dicing, SMT, bonding ...
L Catch-up session for delayed practice parts

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