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Since year 2000 IMST offers multilayer LTCC manufacturing in small quantities for prototypes or samples. All processe steps are carried out from specialised staff under clean-room conditions. The process is compatible with those from foundry services. IMST offers LTCC material systems from established suppliers like DuPont, Ferro and Heraeus. The figure below illustrates the LTCC manufacturing steps with final characterisation possibilities. For details about IMST's capabilities see prototyping.

Manufacturing Capabilities
  • Standard LTCC-Systems: DuPont, Ferro, Heraeus ...
  • Unfired Substrate Sizes: 3.5" x 3.5", 3" x 3" and 2" x 2"
  • Nearly arbitrary Cavities and Windows (Laser-Cut)
  • Thermal Vias
  • R, L and C Integration (Buried Components)
  • Isostatic Lamination
  • Standard Screen Printing Technology
  • High Resolution Conductors => with Partners
  • Zero or unconstrained Sintering => with Partners
  • Post-Processing: Inspection, SMD, Bonding, Dicing, Flip-Chip
  • Characterisation: Inspection, Microwave Circuit and Antenna Measurement, EMC Qualification

IMST's LTCC prototyping steps
©2001-2010 IMST GmbH, Last update: 25-Nov.-2008