Ceramic Microwave Circuits for Satellite Communications
a German BMBF/DLR Project (FKZ 50 YB 0137)
A German BMBF/DLR project (Oct. 03 - Sep. 06): Keramis aims at the development of innovative and inexpensive components for future applications in multimedia satellite communications. The principle of operation and potential benefit for satellite-based systems will be demonstrated. The rationale of the project is to exploit the possibility of integrating passive and active components in LTCC multilayer strucrures, and by minimising the complexity of the semiconducting components. LTCC technology offers a number of benefits such as low-cost production and assembly, compact size and hermetic sealing, which are of utmost importance for satellite-based applications. 3 technological milestones for Ka-band satellite applications used for the down-link have been developt:
- Amplifier technology
- Frequency synthesizer (VCO)
- Reconfigurable 4x4 switch matrix
IMST was responsible for the design and development of amplifiers and voltage controlled oscillators (VCO) in LTCC. In a first step a low cost buffer amplifier was realized to demonstrate and to exhibit the advantages of LTCC. A single chip GaAs transistor was mounted into a hybrid circuit structure, which consists of bandpass filter structures, matching and DC supply circuits. The amplifier was designed into a one layer cavity to ensure an optimal transition through the package wall. This transition was optimized for frequencies up to 40 GHz and ends as a coplanar waveguide at the edges of the LTCC substrate. A Kovar frame was brazed on top of a conductor ring. The package was closed by parallel seam welding a top cover on the Kovar frame. This technology results into a hermitic dense package, which can be applied for satellites. The entire module can be mounted on a carrier substrate with conductive glue. Wire bonds have to be placed to connect the waveguide of the base board with the LTCC module.
A 20 GHz and a 24 GHz VCO were designed by IMST. One Silicon die includes both VCOs. The SiGe (BiCMOS) technology from IHP (Germany, Frankfurt Oder) was applied for these chips to realize a low cost frequency source. The package is equal to the buffer amplifier. The chip has been tested into an individual test fixture before the integration into a LTCC environment. See Keramis-2 for continuous work this project.
In addition to the above described developments IMST supported the KERAMIS partners in testing and evaluating the LTCC technology up to 50 GHz. For that purpose a test coupon was designed with test structures for DuPont's tape systems 951 and 943 (low loss tape). Test circuits are: bandpass filter, stripline and microstrip line ring-resonators, microstrip, coupled and meander lines. This test coupon was manufactured with different conductor technologies: standard and fine line screen printing, photoimageable thickfilm, thinfilm and etched conductors. About 20 tiles were processed from each type and all tiles were compared among each other. As a result a comprehensive study was compiled to draw out the advantages and disadvantages of the different conductor systems.
Test coupon for DuPont 951
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Test coupon for DuPont 943
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Project period:
Oct. 2003 - Sept. 2006 |
Project ID:
50-YB-0317 |
| Partners |
Country |
Description |
| DLR |
DE |
German Space Agency (Bonn): Project Coordinator |
| RHe Microsystems |
DE |
Manufacturer of thick- and thin-film RF circuits; packaging and assembly |
Technical University
Hambug-Harburg |
DE |
Microwave circuit design and characterisation |
| IMST GmbH |
DE |
Microwave circuit design and characterisation; modelling; LTCC prototyping |
MSE Microsystems
Engineering |
DE |
Manufacturer of LTCC circuits and modules |
Technical University
Ilmenau |
DE |
Microwave circuit design and characterisation; LTCC prototyping |
| TESAT Spacecom |
DE |
Supplier of satellite technology |
| # |
References |
| WWW |
DLR Internet Site |
| Flyer |
KERAMIS_Flyer |
| [5] |
R. Kulke, O. Kersten, J. Winkler, C. Günner, G. Möllenbeck, P. Uhlig, M. Rittweger: "Packaged Microwave Components for Ka-Band Multimedia Satellite Communication: Amplifier, Oscillator and Switch Modules", 1st MacroNano-Colloquium on LTCC RF and Microsystem Interconnect, Technische Universität Ilmenau, Nov. 29-30, 2006 |
| [4] |
R. Kulke, O. Kersten, J. Winkler, C. Günner, M. Rittweger: "Packaged Microwave Components for Multimedia Satellite Communication" IMAPS (Wireless/RF Session), San Diego, USA, Oct. 8-12, 2006 |
| [3] |
R. Perrone, H. Thust, S. Rentsch, J.Trabert, M.Hein, J. Müller: "Development and Evaluation of Photodefined Elements for Microwave Modules in LTCC for Space Applications", 15th European Microelectronics and Packaging Conference (IMAPS), Brugge, pp. 146-151, June 12-15, 2005 |
| [2] |
G. Reppe, J. Müller, J. Pohlner, H. Thust, R. Perrone: "Development and Evaluation of Fine Line Structuring Methods for Microwave Packages in Satellite Applications", 15th European Microelectronics and Packaging Conference (IMAPS), Brugge, pp. 390-394, June 12-15, 2005 |
| [1] |
T. Baras and A. F. Jacob, "Advanced Broad-band 2nd-Level-Interconnects for LTCC Multi-Chip-Modules", IEEE German Microwave Con-ference (GeMiC) 2005, pp. 21-24, Ulm, Ger-many, April 2005 |
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