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The Technische Universität Ilmenau has developed an LTCC module incorporating a reconfigurable 4x4 switch matrix. The double-sided module integrates space-qualified PIN-diode SP4T switch ICs with broadband transmission lines and signal distribution networks. Between 18 and 27 GHz, a complete signal path displays return loss > 20 dB, insertion loss < 6 dB (without amplification), and path isolation > 50 dB. The module measures less than 2.5 x 2.5 x 1 cm³ and weighs about 20 g. To monitor performance and reliability on orbit, the flight module will be equipped with a digital controller, redundant signal sources, power detectors, and temperature sensors. The industrial partners of the consortium support the fabrication, implementation and space qualification of the payload module.
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IMST GmbH is responsible for the design and development of tow Ka-band (20 GHz) payload boards. This experimental units are composed of modular LTCC components in hermetically sealed housings. Standard LGA or wire bond transitions are applied for HF transitions. The LTCC components are mounted on a multilayer PTFE substrate. The heart of the module is a fractional-N synthesizer in BiCMOS and CMOS technology with a SiGe VCO. Additional components are hybrid and MMIC amplifiers, mixers, SPDT switch and power detectors. The modular concept allows the implementation of reliable, flexible and space qualified transceiver units for multimedia satellite applications at low costs. The multilayer LTCC is manufactured by MSE while RHE processes the housing as well as the assembly and integration techniques.
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The University Hamburg-Harburg is responsible for successful conversion of a transmitted analogue S-band signal to Ka-band and vice versa is the main goal of this payload module. To this end, different transceiver configurations are designed, which consist of previously developed basic LTCC modules like mixers, signal sources and power amplifiers. The general suitability and versatility of advanced LTCC packaging in combination with hybrid integration methods for high reliability applications are verified.
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