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Recommended Books
[I] Yoshihiko Imanaka: "Multilayered Low Temperature Cofired Ceramics (LTCC) Technology", Springer Berlin, ISBN: 0387231307, Mai 2008
[II] Fred D. Barlow, Aicha Elshabini: "Ceramic Interconnect Technology Handbook", Crc Pr Inc , ISBN: 0849335574, January 2007

Documents
[A] LTCC @ IMST: "Step into a Multi-Layered Future", an IMST presentation (release November 2008)
[B] " LTCC - An Introduction and Overview": material suppliers, LTCC tapes, conductor pastes, design rules, process, foundries, and more ... (Paper-Back = 150 €, PDF-File = 250 €); Order Form

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2010
[60] R. Kulke, P. Uhlig: "LTCC Technology for RF Applications", EEEfCOM, Electrical and Electronic Engineering for Communication, Workshop, Hochschule Ulm, June 17, 2010
[59] W.-J. Byun, B.-S. Kim, K.S. Kim, K.-C. Eun, M.-S. Song, R. Kulke, O. Kersten, G. Möllenbeck, M. Ritttweger,: "40 GHz Vertical Transition with a Dual-Mode Cavity for a Low-Temperature Co-fired Ceramic Transceiver Module", ETRI Journal, vol. 32, no. 2, pp. 195-203, April 2010
[58]
Ger		 R. Kulke, M. Rittweger, V. Heyer: "KERAMIS als Nutzlasttechnologie für die Satellitenkommunikation", 2. Nationale Konferenz "Satellitenkommunikation in Deutschland", Kameha Grand Hotel, Bonn, March 24-25, 2010
[57]
Ger		 P. Uhlig, M. Geissler, S. Holzwarth, R. Kulke, J. Leiss, D. Manteuffel, M. Martínez-Vázquez: "Antennenintegration in keramischen Mehrlagenschaltungen", Magazin: Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Leuze Verlag, S. 166-175, Band 12, Januar 2010

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2009
[56]
Ger		 P. Uhlig, M. Geissler, S. Holzwarth, R. Kulke, J. Leiss, D. Manteuffel, M. Martínez-Vázquez: "Antennenintegration in keramischen Mehrlagenschaltungen", Deutsche IMAPS-Konferenz München Oct. 27-28, 2009
[55] R. Follmann, R. Kulke, S. Holzwarth, P. Uhlig, M. Rittweger: "LTCC packaging and integration technologies", EuMW: European Microwave Week, Rom, Sept. 28 – Oct. 2, 2009
[54] C. Günner, G. Möllenbeck, M. Faaßen, R. Kulke: "Microwave Circuit Technology for Satellite Communication", Project Status Seminar on Ceramic Microwave Circuits for Satellite Communications (KERAMIS 2), Ilmenau University of Technology, Sept. 9, 2009
[53] R. Kulke, G. Möllenbeck, C. Günner, P. Uhlig, K.H. Drüe, S. Humbla, J. Müller, R. Stephan, D. Stöpel, J.F. Trabert, G. Vogt, M.A. Hein, A. Molke, T. Baras, A.F. Jacob, D. Schwanke, J. Pohlner, A. Schwarz, G. Reppe: "Ceramic Microwave Circuits for Satellite Communication", Journal of Microelectronics and Electronic Packaging, Volume 6 No. 1, pp. 27-31, First Quarter 2009
[52] P. Uhlig, S. Holzwarth, M. Geissler: "Antenna Concepts for Ceramic Multilayer Modules", CICMT: Ceramic Interconnect and Ceramic Microsystems Technologies, Denver, Colorado, April 21-23, 2009
[51] I. Wolff: "From Antennas to Microwave Systems - LTCC as an Integrating Technology for Space Applications", Eucap: 3rd European Conference on Antennas and Propagation, pp. 3-8, Berlin, Germany, March 23-27, 2009
[50] S. Holzwarth et al: "SANTANA: Advanced Electronically Steerable Antennas at Ka-Band", Eucap: 3rd European Conference on Antennas and Propagation, 471-478, Berlin, Germany, March 23-27, 2009
[49] M. Rittweger, R. Kulke, R. Follmann, I. Wolff: "Innovative Technologies for RF Circuitry in Satellite Payload", Eucap: 3rd European Conference on Antennas and Propagation, pp. 484-486, Berlin, Germany, March 23-27, 2009
[48] D. Mannteuffel, M. Arnold: "Considerations on configurable multi-standard antennas for mobile terminals realized in LTCC technology", Eucap: 3rd European Conference on Antennas and Propagation, 2541-2545, Berlin, Germany, March 23-27, 2009

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2008
[47]
Ger		 R. Kulke et al.: "Keramische Mikrowellenschaltungen für die Satellitenkommunikation", Deutsche Keramische Gesellschaft, DKG-Handbuch "Keramische Werkstoffe", Kap. 8.9.1.1, November 2008
[46] R. Kulke, C. Günner, G. Möllenbeck, P. Uhlig, M. Rittweger: "Protoflight Model Development for Spaceborne LTCC RF-Modules", IMAPS, 41st International Symposium on Microelectronics, pp. 1001-1006, Rhode Island, November 2-6, 2008
[45] P. Uhlig, R. Follmann, O. Kersten, T. Kohl, R. Kulke, G. Möllenbeck: "A 20 GHz Fractional-N Synthesizer Module for Satellite Operation", IMAPS Nordic, Conference Proceedings pp. 124-128, Helsingoer, Denmark, September 14-16, 2008
[44]
Ger		 R. Kulke, G. Möllenbeck, P. Uhlig, K. Maulwurf: "Entwurf und Optimierung von SMD-Tiefpass-Filtern in LTCC", Magazin: Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Leuze Verlag, S. 1244-1251, Juni 2008
[43] R. Lenz, H.-V. Heyer, R. Kulke, G. Möllenbeck, D. Schwanke, S. Voigt: "Application of the SiMs SiGe PLL in a 20 GHz synthesizer payload module of the German Keramis program", Microwave Technology and Techniques Workshop 2008, Innovation and Challenges, ESA-ESTEC, Noordwijk, May 6-7, 2008
[42] R. Kulke, G. Möllenbeck, C. Günner, P. Uhlig, K.H. Drüe, S. Humbla, J. Müller, R. Stephan, D. Stöpel, J.F. Trabert, G. Vogt, M.A. Hein, A. Molke, T. Baras, A.F. Jacob, D. Schwanke, J. Pohlner, A. Schwarz, G. Reppe: "Ceramic Microwave Circuits for Satellite Communication", CICMT: Ceramic Interconnect and Ceramic Microsystems Technologies, Munich, April 21-24, 2008
[41] P. Uhlig, D. Manteuffel, S. Malkmus: "High Layer Count in LTCC Dual Band Antenna for Galileo GNSS", CICMT: Ceramic Interconnect and Ceramic Microsystems Technologies, Munich, April 21-24, 2008
[40] R. Kulke, G. Möllenbeck, C. Günner, P. Uhlig, M. Rittweger: "LTCC Multi-Chip Modules for Ka-Band Multimedia Satellite Technology", GEMIC: German Microwave Conference, TU-Hamburg-Harburg, pp. 450 - 453, March 10-12, 2008

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2007
[39]
Ger		 P. Uhlig, R. Kulke, G. Möllenbeck, K. Maulwurf: "Entwurf und Optimierung von Tiefpass Filtern als SMD-Bauteil in LTCC", Deutsche IMAPS Konferenz, München, October 8-9, 2007
[38] W. Byun, B.-S. Kim, K.-S. Kim, K.-C. Eun, M. S. Song , R. Kulke, O. Kersten, G. Möllenbeck, M. Rittweger: "Design of Vertical Transition for 40GHz Transceiver Module Using LTCC Technology", European Microwave Week, EuMW, Munich, October 8-12, 2007
[37] I. Wolff: "Design and Technology of Microwave and Millimeterwave LTCC", Circuits and Systems, International Symposium on Signals, Systems and Electronics (ISSSE), July 30 - August 2, pp. 505-512, 2007
[36] R. Kulke, G. Möllenbeck, P. Uhlig, K. Maulwurf, M. Rittweger: "Designing SMD Lowpass Filters in Multilayer LTCC Technology", EMPC: European Microelectronics and Packaging Conference Proceedimgs pp. 40-44, Oulu, Finland, June 17-20, 2007
[35] I. Wolff, R. Kulke, P. Uhlig, T. Mobley: "LTCC for Micro- and Millimeter-Wave Applications", Short Course for IMS: International Microwave Symposium, Honolulu, Hawaii, June 3-8, 2007
[34] J. Müller, R. Perrone, K.-H. Drüe, R. Stephan, J. Trabert, M. Hein, D. Schwanke, J. Pohlner, G. Reppe, R. Kulke, P. Uhlig, A. Jacob, T. Baras, A. Molke: "Comparison of High-Resolution Patterning Technologies for LTCC Microwave Circuits",

A) Proceedings IMAPS/ACerS 3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), pp. 98-103, Denver, CO, USA, 23-26 April 2007

B) Journal of Microelectronic and Electronic Packaging (ISSN # 1551-4897), Volume 4, Number 3, pp. 99-104, 3rd Quater 2007

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2006
[33] R. Kulke, P. Uhlig: "Shielded Waveguides for Microwave Applications in LTCC", 1st MacroNano-Colloquium on LTCC RF and Microsystem Interconnect, Technische Universität Ilmenau, Nov. 29-30, 2006
[32] R. Kulke, O. Kersten, J. Winkler, C. Günner, G. Möllenbeck, P. Uhlig, M. Rittweger: "Packaged Microwave Components for Ka-Band Multimedia Satellite Communication: Amplifier, Oscillator and Switch Modules", 1st MacroNano-Colloquium on LTCC RF and Microsystem Interconnect, Technische Universität Ilmenau, Nov. 29-30, 2006
[31] R. Kulke, O. Kersten, J. Winkler, C. Günner, M. Rittweger: "Packaged Microwave Components for Multimedia Satellite Communication" IMAPS (Wireless/RF Session), Proceedings pp. 241-245, San Diego, USA, Oct. 8-12, 2006
[30] R. Kulke, O. Kersten, G. Möllenbeck, M. Rittweger, B.-S. Kim, K.-S. Kim, W. Byun, M.-S. Song: "Frontend Components for 40 GHz FWA Applications in Multilayer LTCC", IMAPS (Wireless/RF Session), Proceedings pp. 596-602, San Diego, USA, Oct. 8-12, 2006
[29] P. Uhlig, S. Holzwarth, O. Litschke, A. Serwa, D.T. Tran: "On the Influence of Layer-to-Layer Misalignment on the Microwave Performance of LTCC Antenna Modules", IMAPS, San Diego, USA, Oct. 8-12, 2006
[28] I. Wolff, R. Kulke: "LTCC-Technologie zur Systemintegration im Mikrowellen- und Millimeterwellenbereich", EEEfCOM, Ulm, 20.-21. Juni 2006

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2005
[27] P. Uhlig, S. Holzwarth, O. Litschke, W. Simon, R. Baggen: "A Digital Beam-Forming Antenna Module for a Mobile Multimedia Terminal in LTCC-Multilayer Technique", 15th European Microelectronics and Packaging Conference (IMAPS), Brugge, pp. 467-470, June 12-15, 2005
[26] R. Kulke, C. Günner, S. Holzwarth, J. Kassner, A. Lauer, M. Rittweger, P. Uhlig, P. Weigand: "24 GHz Radar Sensor integrates Patch Antenna and Frontend Module in single Multilayer LTCC Substrate", 15th European Microelectronics and Packaging Conference (IMAPS), Brugge, pp. 239-242, June 12-15, 2005
[25] R. Kulke, D. Köther, P. Uhlig J. Kassner, A. Lauer, M. Rittweger: "Technologies for reliable Power Distribution Networks in SAR Earth Observation and Multimedia Communication Satellites", 28th ESA Antenna Workshop on Space Antenna Systems and Technologies, Noordwijk, The Netherlands, 31 May - 3 June 2005

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2004
[24]
Ger		 P. Uhlig, R. Kulke: "Flexibles Prototyping von LTCC Schaltungen für Mikrowellenanwendungen durch die Laserbearbeitung von Grünfolien", Symposium: "Verfahren der keramischen Mehrlagentechnik: Stand und Zukunftsperspektiven", Deutsche Keramische Gesellschaft e.V., Erlangen, 31. November und 1. Dezember 2004
und "Technische Keramische Werkstoffe", 90. Ergänzungslieferung, Januar 2006
[23] P. Uhlig, C. Günner, S. Holzwarth, J. Kassner, R. Kulke, A. Lauer, M. Rittweger: "LTCC Short Range Radar Sensor for Automotive Applications at 24 GHz", Proceedings of the 37th International Symposium on Microelectronics (IMAPS), Long Beach, November 14-18, 2004
[22] E. Grameqna: "24 GHz radar sensor uses Green TapeTM LTCC technology to detect the proximity of objects", DuPont Horizons no. 23, pp. 4-5, October 2004
[21] S. Holzwarth, R. Kulke, J. Kassner, P. Uhlig: "Antenna Integration on LTCC Radar Module for Automotive Applications at 24 GHz", IMAPS Nordic Conference, Helsingør, Denmark, September 26 - 28, 2004
[20] S. Holzwarth, R. Kulke, J. Kassner: "Integrated stacked patch antenna array on LTCC material operating at 24 GHz", IEEE AP-S International Symposium on Antenna and Propagation, Monterey, California, June 20-26, 2004

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2003
[19] R. Kulke, J. Kassner, G. Möllenbeck, M. Rittweger, P. Waldow: "Ka-Band Power-Distribution Networks on Multilayer LTCC for Broadband Satellite Multimedia Applications", EuMC, Workshop WS-8: "Ceramic based Microwave Circuits", Proceedings pp. 17-20, 6. October 2003, Munich
[18]
Ger		 R. Kulke, W. Simon, C. Günner, G. Möllenbeck, D. Köther, M. Rittweger: "Vergleichstest verlustarmer LTCC-Systeme bis 40 GHz", Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Leuze Verlag, Band 5, Seite 1407 - 1413, September 2003
[17] J. Kassner, R. Kulke, P. Uhlig, M., Rittweger, P. Waldow, R., Münnich, H. Thust: "Highly Integrated Power Distribution Networks on Multilayer LTCC for Ka-band Multiple-Beam Phased Array Antennas", IMAPS Nordic Conference, Proceedings pp. 51-54, 21.-24. September 2003, Espoo, Finland
[16] R. Kulke, V. Wahle, D. Sollbach, P. Uhlig, M. Rittweger, S.-P. Schmitz, P. Waldow: "High Level of Integration for Bluetooth Modules on LTCC", IMAPS-Europe EMPC 2003, CD-ROM and Abstractbook p. 16, 23.-25. June 2003, Friedrichshafen, Germany
[15] R. Münnich, H. Thust, R. Kulke: "Multilayer LTCC-Module für HF-Anwendungen", 10. Keramik-Tag der BAM, Symposium: Folien- und Multilayertechnologie für funktionskeramische Anwendungen; Deutsche Keramische Gesellschaft e.V., 10. und 11. April 2003, Berlin

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2002
[14]
Ger		 J. Kassner, R. Kulke, A. Lauer, D. Köther: "LTCC-Breitband-Balun für einen Gegentaktverstärker", Deutsche IMAPS-Konferenz, CD-ROM, 7. - 8. Oktober 2002, München
[13] R. Kulke, G. Möllenbeck, W. Simon, A. Lauer, M. Rittweger: "Point-to-Multipoint Transceiver in LTCC for 26 GHz", IMAPS-Nordic, Proceedings pp. 50-53, 29. Sept.-2. Oct. 2002, Stockholm
[12] R. Kulke, W. Simon, C. Günner, G. Möllenbeck, D. Köther, M. Rittweger: "RF-Benchmark up to 40 GHz for various LTCC Low Loss Tapes", IMAPS-Nordic, Proceedings pp. 97-102, 29. Sept.-2. Oct. 2002, Stockholm
[11]
Ger		 R. Kulke: "LTCC als Materialsystem für Mikrowellenanwendungen", Deutsches IMAPS-Seminar: "Aufbau und Verbindungstechniken für hohe Integration – Eine für alles?", 14. Februar 2002, Göppingen

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2001
[10]
Ger		 R. Kulke, M. Rittweger, P. Uhlig, C. Günner: "LTCC-Mehrlagenkeramik für Funk- und Sensor-Anwendungen", Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Leuze Verlag, Seite 2131-2136, Ausgabe Dezember 2001
+ "LTCC-Multilayer Ceramic for Wireless and Sensor Applications"
[9] R. Kulke, W. Simon, G. Möllenbeck, J. Kassner, P. Uhlig, S. Holzwarth, P. Waldow: "Power Distribution Networks in Multilayer LTCC for Microwave Applications", Proceedings of the International Symposium on Microelectronics (IMAPS), pp. 321-324, Baltimore, October 2001
[8] W. Simon, R. Kulke, A. Lauer, M. Rittweger, P. Waldow, I. Wolff: "Efficient Band Pass Filter Design for a 25 GHz LTCC Multichip Module using Hybrid Optimization", Proceedings of the International Symposium on Microelectronics (IMAPS), pp. 316-320, Baltimore, October 2001
[7] R. Kulke, W. Simon, A. Lauer, M. Rittweger, P. Waldow, S. Stringfellow, R. Powell, M. Harrison, J.-P. Bertinet, "Investigation of Ring-Resonators on Multilayer LTCC", workshop contribution on "Advances in Ceramic Interconnect Technologies for Wireless, R.F. and Microwave Applications" on the International Microwave Symposium IMS 2001, Phoenix, 21st May 2001
[6] S. Holzwarth, J. Kassner, R. Kulke, D. Heberling: "Planar Antenna Arrays on LTCC-Multilayer Technology", ICAP: 11th International Conference on "Antennas and Propagation", pp. 710-714, Manchester, April 2001

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2000
[5] R. Kulke, W. Simon, M. Rittweger, I. Wolff, S. Baker, R. Powell, M. Harrison: "Integration Techniques for MMICs and Chip Devices in LTCC Multichip Modules for Radio Frequencies", Proceedings of the International Symposium on Microelectronics (IMAPS), pp. 642-647, Boston, September 2000
[4] W. Simon, R. Kulke, A. Wien, M. Rittweger, I. Wolff, A. Girard, J.-P. Bertinet: "Interconnects and transitions in Multilayer LTCC Multichip Modules for 24 GHz ISM-Band Applications", IEEE International Microwave Symposium (IMS-2000), pp. 1047-1050, Boston, June 2000

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1998+1999
[3] R. Kulke, M. Rittweger, W. Simon, A. Wien, I. Wolff: "High Resolution Coplanar Structures on Multilayer LTCC for Applications up to 40 GHz", IMAPS Symposium, pp. 79-83, Chicago, October 1999
[2] W. Simon, R. Kulke, A. Wien, I. Wolff, S. Baker, R. Powell, M. Harrison: "Design of Passive Components for K-Band Communication Modules in LTCC Environment",
A) IMAPS Symposium, pp. 183-188, Chicago, October 1999
B) International Journal of "Microcircuits & Electronic Packaging",
pp. 92-98, Vol. 23, No.1, First Quarter, 2000
[1] W. Simon, M. Werthen, I. Wolff: "A Novel Coplanar Transmission Line to Rectangular Waveguide Transition", IEEE MTT-S, Int. Microwave Symp. Digest, pp 257-260, 1998
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