prototyping
via-forming
      
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Via-forming
IMST started LTCC prototyping with a YAG laser to cut out nearly arbitrary shaped cavities and via holes from the unfired LTCC tapes. The quality and the processing speed could be increased with this multi punching machine from UHT:


  • Type: UHT MP-7150Z
  • Number of Punch Units (Shafts): 7
  • Processing Area: 150 x 150 mm²
  • Speed: 1000 holes/min
  • Accuracy: ± 10µm
  • Diameter: 50 ... 6900 µm



Filmlet: Via and cavity punching

Punch tool

©2001-2010 IMST GmbH, Last update: RK, 25-May-2010