The via holes will be filled with thick film pastes using the screen printing method. An accurate alignment of the stencil and the tape can be achieved with an optical positioning system combined with the screen printer. The EKRA printer M2
TM fulfils these demands and is used in IMST's LTCC process. (see
www.ekra.de)
Via filling technique with screen printer, porous nest and vacuum under LTCC tape.
Screen printer for via filling with accurate alignment system.
print view