A number of post-processing steps are offered for the LTCC prototype manufacturing: post-firing of conductors and resistors, surface mount technology and wire bonding, dicing, singulation or sawing and the inspection of the LTCC module. This includes an optical check and a measurement of the geometry under the microscope as well as a high frequency characterisation.
- Post firing (e.g. conductors or resistors)
- SMT (pick and place equipment)
- Wire bonding (10 ... 250 µm diameter)
- Dicing, Sawing, Singulation
- Resistor trimming with YAG-laser
- Optical inspection with microscope
- Brazing
- RF-characterisation
(circuits: on-wafer, coaxial ...
antennas: near field, far field, out-door ...)
Dicing saw
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Bonding system
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YAG-Laser from Laser Systems (7032)
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Pick and place tool
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©2001-2010 IMST GmbH, Last update: RK, 25-May-2010
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